The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2021
Filed:
Jul. 26, 2017
Applicant:
Hewlett-packard Development Company, L.p., Spring, TX (US);
Inventors:
Michael W Cumbie, Corvallis, OR (US);
Anthony Fuller, Corvallis, OR (US);
Chien-Hua Chen, Corvallis, OR (US);
Zhen Yi Li, Corvallis, OR (US);
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); B41J 2/16 (2006.01); B41J 2/045 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14072 (2013.01); B41J 2/1637 (2013.01); B41J 2/04541 (2013.01); B41J 2/14201 (2013.01); B41J 2/1623 (2013.01); B41J 2002/14491 (2013.01);
Abstract
Examples include a fluid die embedded in a molded panel. The fluid die includes a substrate, and the substrate includes a first surface. The molded panel surrounding sides of the fluid die such that the first surface is disposed below a top surface of the molded panel. A raised contact formation is disposed on the substrate to extend at least up to the top surface of the molded panel.