The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2021
Filed:
Feb. 14, 2019
Applicant:
Ethicon, Inc., Somerville, NJ (US);
Inventors:
Sasa Andjelic, Nanuet, NY (US);
Dominick Egidio, Flanders, NJ (US);
Assignee:
Ethicon, Inc., Somerville, NJ (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/10 (2006.01); B29C 48/08 (2019.01); B29C 48/00 (2019.01); B32B 27/00 (2006.01); B32B 37/15 (2006.01); A61K 9/70 (2006.01); A61L 31/14 (2006.01); B29C 48/92 (2019.01); A61L 31/04 (2006.01); A61L 31/10 (2006.01); B29C 55/30 (2006.01); B32B 5/02 (2006.01); B32B 27/12 (2006.01); B32B 37/06 (2006.01); B32B 37/00 (2006.01); A61F 2/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B32B 37/10 (2013.01); A61K 9/7007 (2013.01); A61L 31/042 (2013.01); A61L 31/048 (2013.01); A61L 31/10 (2013.01); A61L 31/14 (2013.01); A61L 31/148 (2013.01); B29C 48/0018 (2019.02); B29C 48/0021 (2019.02); B29C 48/022 (2019.02); B29C 48/08 (2019.02); B29C 48/92 (2019.02); B29C 55/30 (2013.01); B32B 5/022 (2013.01); B32B 5/024 (2013.01); B32B 5/028 (2013.01); B32B 27/00 (2013.01); B32B 27/12 (2013.01); B32B 37/06 (2013.01); B32B 37/15 (2013.01); A61F 2/0063 (2013.01); A61L 2420/02 (2013.01); B29C 48/0022 (2019.02); B29C 2948/92704 (2019.02); B29C 2948/92942 (2019.02); B29C 2948/92961 (2019.02); B29K 2995/004 (2013.01); B29L 2031/753 (2013.01); B32B 2037/0092 (2013.01); B32B 2305/10 (2013.01); B32B 2535/00 (2013.01);
Abstract
The invention relates to novel processes for the lamination of semi-crystalline, high-melting point, low glass transition polymeric films, which are extruded and subsequently laminated on various thermally sensitive substrates to form laminated medical device constructs in a specific time interval to allow low processing temperatures to avoid polymer film and/or substrate degradation or heat-related distortions. Also disclosed are laminated medical device constructs made from such processes.