The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 05, 2021

Filed:

Mar. 17, 2016
Applicant:

Evonik Operations Gmbh, Essen, DE;

Inventors:

Jasmin Berger, Dortmund, DE;

Rainer Goering, Borken, DE;

Klaus Gahlmann, Marl, DE;

Michael Boeer, Olfen, DE;

Mario Resing, Stadtlohn, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/08 (2006.01); B32B 27/18 (2006.01); B32B 27/32 (2006.01); F16L 11/00 (2006.01); F16L 9/00 (2006.01); B32B 27/34 (2006.01); C08G 69/26 (2006.01); C08L 77/06 (2006.01); C08L 77/02 (2006.01); C08L 51/04 (2006.01); C08K 3/04 (2006.01); C08K 5/098 (2006.01);
U.S. Cl.
CPC ...
B32B 27/322 (2013.01); B32B 27/08 (2013.01); B32B 27/18 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); C08G 69/265 (2013.01); C08K 3/04 (2013.01); C08K 5/098 (2013.01); C08L 51/04 (2013.01); C08L 77/02 (2013.01); C08L 77/06 (2013.01); F16L 9/00 (2013.01); F16L 11/00 (2013.01); B32B 2250/24 (2013.01); B32B 2307/7242 (2013.01); B32B 2439/00 (2013.01); B32B 2597/00 (2013.01); C08K 3/041 (2017.05);
Abstract

A multilayer composite containing the following layers: I. a first layer (layer I) of a moulding compound containing at least 40 wt. % of the following components: 1) 60 to 99 parts by wt. of a copolyamide based on hexamethylenediamine, terephthalic acid and an aliphatic dicarboxylic acid having 8 to 19 carbon atoms and 2) 40 to 1 parts by wt. of an olefinic copolymer as impact modifier, wherein the parts by wt. of 1) and 2) sum to 100; and II. a second layer (layer II) of a moulding compound containing at least 60 wt. % of fluoropolymer, has a high heat distortion temperature, a very good impact resistance, a high elongation at break and good layer adhesion.


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