The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 05, 2021

Filed:

May. 29, 2020
Applicant:

Samsung Display Co., Ltd., Yongin-Si, KR;

Inventors:

Hyun a Lee, Seoul, KR;

Chan-Jae Park, Suwon-si, KR;

Heeju Woo, Tongyeong-si, KR;

Kikyung Youk, Bucheon-si, KR;

Sangduk Lee, Yongin-si, KR;

Daehwan Jang, Seoul, KR;

Assignee:

SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 65/00 (2006.01); B29C 65/08 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
B29C 65/08 (2013.01); H05K 3/303 (2013.01); B29C 65/081 (2013.01); B29C 65/088 (2013.01);
Abstract

An ultrasonic bonding apparatus includes a stage on which a display panel is seated, a first ultrasonic generation unit which is connected to the stage and vibrates in a first direction and provide a first polarization, and a second ultrasonic generation unit in which an electronic component is seated and which vibrates in a second direction that is crossed with the first direction, and provides a second polarization, where a third polarization is provided on a plane on which the display panel contacts the electronic component.


Find Patent Forward Citations

Quick Actions:

Lee, Hyun. (2021). Ultrasonic bonding apparatus and ultrasonic bonding method using the same (U.S. Patent No. 11135779). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11135779

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