The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 05, 2021

Filed:

Mar. 06, 2018
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Fabrizio Mangano, Dottikon, CH;

Piero-Daniele Grasso, Niederweningen, CH;

Norbert Lucke, Neuenhof, CH;

Michael Seemann, Laufenburg, DE;

Assignee:

General Electric Company, Schenectady, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/26 (2014.01); B23K 35/02 (2006.01); B23P 6/04 (2006.01); B23K 26/60 (2014.01); B23P 6/00 (2006.01); F01D 5/00 (2006.01); C22F 1/10 (2006.01); B23K 26/34 (2014.01); B23K 26/00 (2014.01); B23K 26/70 (2014.01); B23K 103/18 (2006.01); B23K 101/00 (2006.01); B23K 103/00 (2006.01); B23K 101/34 (2006.01);
U.S. Cl.
CPC ...
B23K 26/26 (2013.01); B23K 26/0006 (2013.01); B23K 26/34 (2013.01); B23K 26/60 (2015.10); B23K 26/702 (2015.10); B23K 35/0261 (2013.01); B23P 6/007 (2013.01); B23P 6/04 (2013.01); C22F 1/10 (2013.01); F01D 5/005 (2013.01); B23K 2101/001 (2018.08); B23K 2101/34 (2018.08); B23K 2103/26 (2018.08); B23K 2103/52 (2018.08);
Abstract

Methods of repair of a component or adding material to a component using laser welding are disclosed. One method may include repairing or adding material to the component by laser irradiating a wire material with a laser in an inert gas in a vicinity of the component. The laser irradiating the wire material includes modulated pulsing the laser through: a warm up phase during which an on-power of the laser is increased over time to a maximum target on-power, a melt and bond phase during which the wire material is melted and during which the on-power is less than the maximum target on-power, and a stress releasing phase during which the on-power of the laser is less than the on-power during the melt and bond phase. The laser irradiated wire material forms a weld material to repair a damaged area or add material to the component.


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