The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2021
Filed:
Feb. 04, 2019
Grid Logic Incorporated, Lapeer, MI (US);
Matthew James Holcomb, Metamora, MI (US);
Ira James Holcomb, Jr., Shelby Township, MI (US);
GRID LOGIC INCORPORATED, Lapeer, MI (US);
Abstract
A mould-forming and sacrificial materials are printed into a plurality of layers. The sacrificial material is removed to leave a void defined by a mould structure formed by the mould-forming material. The void is filled with a part-forming material to form the part defined by the shape of the mould structure. The mould structure is removed from the part to free the part from the mould structure. According to a further method, the part-forming material serves the purpose of supporting the mould-forming material and then forming the part. In this case, the part-forming material can be printed together with a mould-forming material as described above and are then heated to a temperature of approximately 700° C. to activate a binder and then heated to a temperature that melts the part-forming material.