The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 05, 2021

Filed:

Feb. 18, 2017
Applicants:

University of Southern California, Los Angeles, CA (US);

The Regents of the University of California, Oakland, CA (US);

Inventors:

Robert G. Wodnicki, Los Angeles, CA (US);

Qifa Zhou, Arcadia, CA (US);

Thomas Matthew Cummins, Venice, CA (US);

Douglas N. Stephens, Davis, CA (US);

Katherine W. Ferrara, Davis, CA (US);

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 8/00 (2006.01); B06B 1/06 (2006.01); H01L 41/04 (2006.01); H01L 41/113 (2006.01);
U.S. Cl.
CPC ...
A61B 8/4488 (2013.01); B06B 1/0622 (2013.01); H01L 41/04 (2013.01); H01L 41/1132 (2013.01);
Abstract

A modular array includes modular array includes one or more array modules. Each array module includes one or more transducer arrays, where each of the one or more transducer arrays includes a plurality of piezoelectric elements; a conducting interposer arranged and configured to provide acoustic absorbing backing for the one or more transducer arrays; and one or more Application Specific Integrated Circuits (ASICs). The conducting interposer and the one or more ASICs are in electrical contact with each other at a first direct electrical interface. Additionally, the conducting interposer and the one or more transducer arrays are in electrical contact with each other at a second direct electrical interface.


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