The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 28, 2021

Filed:

Oct. 14, 2015
Applicant:

Yamaha Hatsudoki Kabushiki Kaisha, Iwata, JP;

Inventor:

Kazushi Takama, Iwata, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 13/04 (2006.01); H05K 13/08 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0452 (2013.01); H05K 13/0465 (2013.01); H05K 13/082 (2018.08); H05K 13/083 (2018.08);
Abstract

A component mounting device includes a mounting portion that mounts a component on a bonding material disposed on a substrate, and a measurement unit that measures a state of the bonding material at least after an operation of mounting the component performed by the mounting portion. The component mounting device further includes a control unit that verifies the state of the bonding material based on a measurement result obtained by the measurement unit when defective mounting of the component has occurred.


Find Patent Forward Citations

Takama, Kazushi. (2021). Component mounting device (U.S. Patent No. 11134597). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11134597

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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