The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 2021
Filed:
Sep. 03, 2019
Applicant:
Assembléon B.v., Eindhoven, NL;
Inventors:
Assignee:
ASSEMBLEON B.V., Eindhoven, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 13/04 (2006.01); H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01L 23/00 (2006.01); H05K 13/04 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0404 (2013.01); H01L 21/67132 (2013.01); H01L 21/67144 (2013.01); H01L 21/6836 (2013.01); H01L 24/741 (2013.01); H01L 24/90 (2013.01);
Abstract
A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; and a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool having a contact portion for contacting the die during a transfer from the die supply source to the substrate, the bond head including a spring portion engaged with the bond tool such that the spring portion is configured to compress during pressing of the die against the substrate using the contact portion of the bond tool.