The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 2021
Filed:
Nov. 05, 2019
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventor:
Jun Oh Hwang, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 1/16 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/22 (2006.01); H05K 3/32 (2006.01); H05K 3/36 (2006.01); H05K 3/40 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4691 (2013.01); H05K 1/183 (2013.01); H05K 1/189 (2013.01); H05K 3/4682 (2013.01);
Abstract
A printed circuit board has a first base region and a flexible region. The printed circuit board includes a core layer including a first insulating layer including a high elastic material and a first wiring layer disposed on the first insulating layer; a first build-up layer disposed on the core layer in the first base region, and including a second insulating layer including a low elastic material, and having a first through portion penetrating through the second insulating layer; and a first electronic component disposed in the first through portion and connected to the first wiring layer.