The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 2021
Filed:
Jan. 16, 2019
Applicant:
Cyntec Co., Ltd., Hsinchu, TW;
Inventors:
Assignee:
CYNTEC CO., LTD., Hsinchu, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/29 (2006.01); H05K 1/18 (2006.01); H01F 5/00 (2006.01); H01F 27/06 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01F 5/00 (2013.01); H01F 27/06 (2013.01); H01F 27/29 (2013.01); H01F 27/292 (2013.01); H01F 2027/065 (2013.01); H01F 2027/297 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10174 (2013.01);
Abstract
An electronic module includes: a lead frame having at least one metal strip and a plurality of metal leads, wherein a magnetic body encapsulates a portion of each of the at least one metal strip with two ends of each of the at least one metal strip not covered by the magnetic body; and a substrate disposed on the lead frame, wherein the substrate is electrically connected to the plurality of metal leads and the at least one metal strip.