The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 28, 2021

Filed:

Sep. 29, 2020
Applicants:

Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;

Qing Ding Precision Electronics (Huaian) Co.,ltd, Huai an, CN;

Inventors:

Hsiao-Ting Hsu, New Taipei, TW;

Ming-Jaan Ho, New Taipei, TW;

Fu-Yun Shen, Shenzhen, CN;

Li-Kun Liu, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 1/02 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01); H05K 3/06 (2006.01); H05K 1/18 (2006.01); H05K 3/40 (2006.01); H05K 3/28 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0274 (2013.01); H05K 1/09 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 3/06 (2013.01); H05K 3/28 (2013.01); H05K 3/32 (2013.01); H05K 3/4007 (2013.01); H05K 3/4644 (2013.01); H05K 2201/0108 (2013.01); H05K 2203/0502 (2013.01);
Abstract

A transparent PCB includes a transparent base film, a hardened layer, an electrode film, a first conductive paste, a second conductive paste, and an electronic component. The hardened layer is formed on a side of the transparent base film. The electrode film is formed on a side of the hardened layer. The electrode film includes a first transparent conductive oxide layer, a metal layer, and a second transparent conductive oxide layer. The first conductive paste is formed on the electrode film. The second conductive paste is formed on the electrode film and spaced from the first conductive paste. The electronic component is electrically connected to the electrode film through the first conductive paste and the second conductive paste. The present invention also needs to provide a method for manufacturing the transparent PCB.


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