The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 2021
Filed:
Jul. 26, 2019
Applicant:
Fuji Electric Co., Ltd., Kawasaki, JP;
Inventors:
Yuichiro Hinata, Matsumoto, JP;
Tatsuo Nishizawa, Matsumoto, JP;
Assignee:
FUJI ELECTRIC CO., LTD., Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/58 (2011.01); H01L 23/492 (2006.01); H01R 43/20 (2006.01); H01L 21/48 (2006.01); H01R 13/03 (2006.01);
U.S. Cl.
CPC ...
H01R 12/58 (2013.01); H01L 21/4853 (2013.01); H01L 23/492 (2013.01); H01R 13/03 (2013.01); H01R 43/205 (2013.01);
Abstract
A semiconductor device includes: an insulation circuit substrate including a metal layer and an insulation substrate, the metal layer being formed on one surface of the insulation substrate, a connecting member having a cylindrical shape joined to the metal layer via a bonding material, a terminal pin inserted in the connecting member, and a reinforcement member having a cylindrical shape disposed on an outer periphery of the connecting member. The reinforcement member is made of a material having a hardness greater than that of the connecting member.