The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 28, 2021

Filed:

Jun. 01, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Hsueh-Chung Chen, Cohoes, NY (US);

Roger A. Quon, Rhinebeck, NY (US);

Chih-Chao Yang, Glenmont, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/02 (2006.01); H01L 23/532 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76823 (2013.01); H01L 21/02332 (2013.01); H01L 21/7684 (2013.01); H01L 21/76814 (2013.01); H01L 21/76846 (2013.01); H01L 21/76871 (2013.01); H01L 21/76877 (2013.01); H01L 23/5226 (2013.01); H01L 23/53238 (2013.01);
Abstract

A nitridation treatment method is provided. The nitridation treatment method includes executing a nitridation treatment with respect to a hydrophobic surface defining an interconnect trench to convert the hydrophobic surface to a hydrophilic surface. The nitridation treatment method further includes depositing a seed layer including a conductive material and manganese on the hydrophilic surface. The nitridation treatment method also includes thermally driving all the manganese out of the seed layer to form a diffusion barrier including manganese at the hydrophilic surface. In addition, the nitridation treatment method includes filling remaining space in the interconnect trench with the conductive material to form an interconnect.


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