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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11133202 B1

PDFFull Text
Date of Patent:
Sep. 28, 2021

Filed:

Sep. 30, 2016

Substrate heating apparatus with enhanced temperature uniformity characteristic

Applicant:

Mico Ltd., Anseong-si, KR;

Inventors:

Chul Ho Jung, Incheon, KR;

Jin Young Choi, Anseong-si, KR;

Yoon Ho Choi, Anseong-si, KR;

Assignee:

MiCo Ceramics Ltd., Anseong-si, KR;

Attorney:

Barcelo, Harrison & Walker, LLP

Primary Examiner:

Tuan N Nguyen

Int. Cl.
CPC ...
H01L 21/67 (2006.01); C23C 14/54 (2006.01); C23C 16/46 (2006.01); C23C 16/458 (2006.01); H01L 21/687 (2006.01); H05B 3/14 (2006.01); H05B 3/28 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67103 (2013.01); C23C 14/541 (2013.01); C23C 16/4586 (2013.01); C23C 16/46 (2013.01); H01L 21/67109 (2013.01); H01L 21/68742 (2013.01); H01L 21/68785 (2013.01); H05B 3/143 (2013.01); H05B 3/283 (2013.01); H05B 2203/014 (2013.01); H05B 2203/037 (2013.01);
Abstract

The present invention relates to a substrate heating apparatus. More specifically, the present invention relates to a substrate heating apparatus including a first heating element located in an inner region of the substrate heating apparatus, a second heating element located in an outer region, and a third heating element supplying current to the second heating element passing through the inner region, wherein the diameter of a wire constituting the third heating element is thicker than the diameter of a wire constituting the second heating element, thereby inhibiting the generation of an overheating region by the heating of the third heating element.

Find Patent Forward Citations

Jung, Chul. (2021). Substrate heating apparatus with enhanced temperature uniformity characteristic (U.S. Patent No. 11133202). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11133202

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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