The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 28, 2021

Filed:

Jun. 23, 2017
Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Kentaro Sano, Ehime, JP;

Taiki Kuroda, Ehime, JP;

Reo Takaiwa, Ehime, JP;

Noriyuki Hirano, Ehime, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C08J 5/24 (2006.01); C08K 5/16 (2006.01); C08L 63/04 (2006.01); C08K 5/3445 (2006.01); C08K 5/55 (2006.01); C08G 59/38 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); C08G 59/38 (2013.01); C08J 5/24 (2013.01); C08K 5/16 (2013.01); C08K 5/3445 (2013.01); C08K 5/55 (2013.01); C08L 63/04 (2013.01); C08J 2363/02 (2013.01); C08J 2463/00 (2013.01); C08J 2463/06 (2013.01); C08L 2205/025 (2013.01); C08L 2205/03 (2013.01);
Abstract

The present invention provides an epoxy resin composition that serves to produce a cured epoxy resin that simultaneously realizes a high heat resistance, a high elastic modulus, and a low color and to produce a molded article having a good appearance without suffering the formation of white spots on the surface thereof when used as matrix resin in a fiber reinforced composite material. The epoxy resin composition includes an epoxy resin as component [A], an aromatic urea [B1] and/or an imidazole compound [B2] as component [B], and a borate ester compound as component [C], containing dicyandiamide in the amount of 0.5 part by mass or less relative to the total quantity of epoxy resins which accounts for 100 parts by mass, wherein the epoxy resin composition meets certain sets of further requirements with respect to its composition.


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