The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 28, 2021

Filed:

May. 06, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Dylan J. Boday, Tucson, AZ (US);

Joseph Kuczynski, North Port, FL (US);

Timothy C. Mauldin, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 5/00 (2006.01); C08G 81/02 (2006.01); H01L 23/373 (2006.01); H01L 23/427 (2006.01); C08F 299/04 (2006.01); C08G 63/676 (2006.01); H01L 23/00 (2006.01); C08G 65/332 (2006.01); C09K 5/02 (2006.01); C09K 5/06 (2006.01);
U.S. Cl.
CPC ...
C08G 81/021 (2013.01); C08F 299/0485 (2013.01); C08G 63/676 (2013.01); C08G 65/3322 (2013.01); C09K 5/00 (2013.01); C09K 5/02 (2013.01); C09K 5/06 (2013.01); H01L 23/3737 (2013.01); H01L 23/4275 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/83201 (2013.01);
Abstract

In an embodiment, an article of manufacture includes a first component, a second component, and a thermal interface material. The thermal interface material is disposed between the first component and the second component and includes a polymeric phase-change material. In another embodiment, an article of manufacture includes a first component, a second component, and a thermal interface material disposed between the first component and the second component, the thermal interface material including a polymeric phase-change material, the polymeric phase-change material including a block copolymer formed from a diene, the diene formed from a vinyl-terminated fatty acid monomer having a chemical formula CH—R—C(O)OH and an ethylene glycol monomer having a chemical formula CHO.


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