The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 28, 2021

Filed:

Jul. 15, 2016
Applicant:

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Inventors:

Hiroshi Tazawa, Kanagawa, JP;

Toshihiro Kurobe, Kanagawa, JP;

Sotetsu Saito, Tokyo, JP;

Hiroyasu Matsugai, Kanagawa, JP;

Hiroyuki Itou, Kanagawa, JP;

Suguru Saito, Kanagawa, JP;

Keiji Ohshima, Tokyo, JP;

Nobutoshi Fujii, Kanagawa, JP;

Toshiaki Shiraiwa, Kanagawa, JP;

Minoru Ishida, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29D 11/00 (2006.01); G02B 3/00 (2006.01); H01L 27/146 (2006.01); B29C 43/18 (2006.01); B29C 43/50 (2006.01);
U.S. Cl.
CPC ...
B29D 11/00307 (2013.01); B29D 11/00375 (2013.01); G02B 3/0062 (2013.01); B29C 43/18 (2013.01); B29C 43/50 (2013.01); B29D 11/00865 (2013.01); G02B 3/0068 (2013.01); H01L 27/14618 (2013.01); H01L 27/14625 (2013.01); H01L 27/14627 (2013.01);
Abstract

To suppress occurrence of contamination or damage to a lens. In the present technology, for example, a manufacturing apparatus allows a spacer which is thicker than a height of a lens resin portion protruded from a substrate to be adhered to the substrate. In addition, for example, in the present technology, the manufacturing apparatus molds the lens resin portion inside a through-hole formed in the substrate by using a mold frame configured with two layers of molds and, after molding the lens resin portion, in the state that one mold is adhered to the substrate, the manufacturing apparatus demolds the substrate from the other mold. The present technology can be applied to, for example, a lens-attached substrate, a stacked lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic apparatus, a computer, a program, a storage medium, a system, or the like.


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