The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 28, 2021

Filed:

Feb. 26, 2019
Applicant:

Formlabs, Inc., Somerville, MA (US);

Inventors:

Justin Keenan, Lexington, MA (US);

Brendan Pratt, Somerville, MA (US);

Maxim Lobovsky, Cambridge, MA (US);

Assignee:

Formlabs, Inc., Somerville, MA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/153 (2017.01); B29C 64/268 (2017.01); B29C 64/295 (2017.01); B29C 64/286 (2017.01); B33Y 30/00 (2015.01); B33Y 10/00 (2015.01);
U.S. Cl.
CPC ...
B29C 64/153 (2017.08); B29C 64/268 (2017.08); B29C 64/286 (2017.08); B29C 64/295 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12);
Abstract

Substantially equal amounts of thermal energy may be provided over a build area of an additive fabrication device using as few as one heat source by selectively attenuating thermal energy emitted by the heat source. The thermal energy may be selectively attenuated by a structure that blocks portions of the thermal energy from being directly incident upon the build area such that the heat is normalized over the build area. The heat distribution over the build area may, in some embodiments, approximate the heat distribution produced by a flat field heating element, yet may be produced at comparatively lower cost and with less complex engineering.


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