Use of molding materials based on vinyl aromatic/diene block copolymers for 3-d-printing

Abstract

The invention relates to the use of molding materials for 3-D printing, containing components A, B1, B2, and C, wherein: A:5 to 100 wt % of at least one vinyl aromatic/diene block copolymer A, containing: a) 30 to 95 wt % of at least one vinyl aromatic and b) 5 to 70 wt % of at least one diene, B1:0 to 95 wt % of at least one polymer B1 selected from the group comprising standard polystyrene, high-impact polystyrene (HIPS), styrene/acrylonitrile copolymers, α-methylstyrene/acrylonitrile copolymers, styrene/maleic anhydride copolymers, styrene/phenylmaleimide copolymers, styrene/methylmethacrylate copolymers, styrene/acrylonitrile/maleic anhydride copolymers, styrene/acrylonitrile/phenylmaleimide copolymers, methylstyrene/acrylonitrile/methylmethacrylate copolymers, α-methylstyrene/acrylonitrile/t-butyl methacrylate copolymers, and styrene/acrylonitrile/t-butyl methacrylate copolymers, B2:0 to 60 wt % of one or more further polymers B2 selected from: polycarbonates, polyamides, poly(meth)acrylates, polyesters, semicrystalline polyolefins, and polyvinyl chloride, C:0 to 50 wt % of common additives and auxiliary agents, wherein the viscosity (measured as per ISO 11443) of the molding material at shear rates of 1 to 10 1/s and at temperatures of 250° C. is not greater than 1×10Pa*s and the melt volume rate (MVR, measured as per ISO 1133 at 220° C. and 10 kg load) is more than 6 ml/10 min.