The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 28, 2021

Filed:

Jul. 29, 2015
Applicant:

Gentex Corporation, Zeeland, MI (US);

Inventors:

Kurtis L. Geerlings, Zeeland, MI (US);

David J. Cammenga, Zeeland, MI (US);

Donald L. Bareman, Zeeland, MI (US);

Henry A. Luten, Holland, MI (US);

Assignee:

GENTEX CORPORATION, Zeeland, MI (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/082 (2014.01); B23K 26/361 (2014.01); G02B 5/08 (2006.01); B23K 26/0622 (2014.01); B23K 26/14 (2014.01); B23K 26/362 (2014.01); B23K 26/402 (2014.01); G02B 27/00 (2006.01); B23K 103/08 (2006.01); B23K 103/16 (2006.01); G02B 5/18 (2006.01);
U.S. Cl.
CPC ...
B23K 26/082 (2015.10); B23K 26/0622 (2015.10); B23K 26/14 (2013.01); B23K 26/361 (2015.10); B23K 26/362 (2013.01); B23K 26/402 (2013.01); G02B 5/08 (2013.01); G02B 27/0012 (2013.01); B23K 2103/08 (2018.08); B23K 2103/172 (2018.08); G02B 5/1857 (2013.01); G03H 2260/62 (2013.01);
Abstract

A laser ablation process can be configured to reduce the appearance of or eliminate a potentially objectionable diffraction effect that can occur when a workpiece or product that has been subjected to the ablation process interacts with light. The diffraction effect can be reduced by introducing irregularity into the arrangement of overlapping laser spots during the process. Other process parameters may be modified to reduce the diffraction effect, such as laser scan speed, laser pulse frequency, the position of the focal plane of the laser, the configuration of raster lines, or the energy profile of the laser beam, for example. The process modifications and configurations are particularly useful with products including an ablated surface that is intended to reflect light or to allow light to pass therethrough as part of its function.


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