The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 21, 2021

Filed:

Apr. 12, 2019
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Charissa Rujanavech, Santa Cruz, CA (US);

Patrick S. Wieler, Austin, TX (US);

Sean P. Shannon, San Francisco, CA (US);

Thomas Loeper, Bartlett, IL (US);

David Novak, Bartlett, IL (US);

Dan Powell, Bartlett, IL (US);

Jason Schwarz, Bartlett, IL (US);

John Sever, Bartlett, IL (US);

Darragh Staunton, Bartlett, IL (US);

Assignee:

APPLE INC., Cupertino, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 13/08 (2006.01); H05K 13/04 (2006.01); B25J 11/00 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0486 (2013.01); B25J 11/005 (2013.01); H05K 13/08 (2013.01); H05K 2203/176 (2013.01); Y10T 29/49819 (2015.01); Y10T 29/49822 (2015.01); Y10T 29/53274 (2015.01);
Abstract

According to some embodiments, a method operable by an electronic component recovery system for detaching an electronic component adhesively bonded to a housing by way of an adhesive bond, is described. The electronic component is carried within a cavity defined by the housing of a portable electronic device. The method can include while the housing having the electronic component attached thereto is located at an electronic component detaching module, where the electronic component detaching module includes a movable arm capable of rotating about a hinge: cooling the housing and the electronic component attached thereto to a temperature that is low enough to weaken the adhesive bond, and causing the movable arm to rotate about the hinge such that a portion of the housing strikes a detachment element with sufficient force to separate the electronic component from the housing.


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