The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 21, 2021

Filed:

Sep. 10, 2018
Applicants:

Te Connectivity Nederland Bv, s'Hertogenbosch, NL;

Tyco Electronics Uk Ltd, Swindon, GB;

Inventors:

Jeroen Iedema, Wolvega, NL;

Olaf Leijnse, Asten, NL;

Peter Poorter, Wijk en Aalburg, NL;

Jonathan Catchpole, West Hanney, GB;

Assignees:

TE Connectivity Nederland BV, S'Hertogenbosch, NL;

Tyco Electronics UK Ltd, Dorcan, GB;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H01R 12/71 (2011.01); H05K 7/20 (2006.01); F21V 23/00 (2015.01); F21V 23/06 (2006.01); F21V 19/00 (2006.01); F21V 19/04 (2006.01); F21Y 115/10 (2016.01); H01R 12/70 (2011.01); H05K 3/00 (2006.01); H05K 3/32 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/142 (2013.01); F21V 19/004 (2013.01); F21V 19/0055 (2013.01); F21V 19/04 (2013.01); F21V 23/005 (2013.01); F21V 23/006 (2013.01); F21V 23/06 (2013.01); H01R 12/714 (2013.01); H05K 1/141 (2013.01); H05K 7/20509 (2013.01); F21Y 2115/10 (2016.08); H01R 12/707 (2013.01); H01R 12/7064 (2013.01); H05K 1/184 (2013.01); H05K 3/0061 (2013.01); H05K 3/325 (2013.01); H05K 2201/048 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/10106 (2013.01);
Abstract

A socket assembly comprises a base frame formed of a thermally conductive material holding a light emitting diode (LED) package to a support structure, a contact element electrically contacting the LED package, and an isolator PCB. The LED package includes an LED PCB having an LED mounted on the LED PCB. The base frame includes a base mounted to the support structure and mechanically engaging the LED PCB so that the LED package is attached to the support structure with a predetermined holding force. The contact element electrically connects the isolator PCB to the LED PCB. The isolator PCB supplies electrical power to the LED. The isolator PCB has a first surface and a second surface; the second surface is in heat transmitting contact with the base frame and the electronic component is disposed on the first surface of the isolator PCB and electrically connected to the LED.


Find Patent Forward Citations

Loading…