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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11129271 B1

PDFFull Text
Date of Patent:
Sep. 21, 2021

Filed:

May. 15, 2018

Motor, circuit board, and engine cooling module including the motor

Applicant:

Johnson Electric S.a., Murten, CH;

Inventors:

Yue Li, Hong Kong, CN;

Youqing Xiang, Shenzhen, CN;

Xiaojun Yan, Shenzhen, CN;

Nan Zheng, Shenzhen, CN;

Minghua Xiong, Shenzhen, CN;

Yun Chen, Shenzhen, CN;

Assignee:

JOHNSON ELECTRIC INTERNATIONAL AG, Murten, CH;

Attorney:

Millman IP Inc.

Primary Examiner:

Naishadh N Desai

Int. Cl.
CPC ...
H02K 11/33 (2016.01); H05K 1/02 (2006.01); H02K 9/22 (2006.01); H02K 5/22 (2006.01); F04D 25/06 (2006.01); F01P 5/04 (2006.01); F04D 29/58 (2006.01); H02K 1/12 (2006.01); H02K 1/27 (2006.01); H02K 5/04 (2006.01); H02K 7/00 (2006.01); H02K 9/00 (2006.01); H05K 1/18 (2006.01); H02K 7/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0204 (2013.01); F01P 5/04 (2013.01); F04D 25/06 (2013.01); F04D 25/0606 (2013.01); F04D 25/068 (2013.01); F04D 29/5813 (2013.01); H02K 1/12 (2013.01); H02K 1/2786 (2013.01); H02K 5/04 (2013.01); H02K 5/225 (2013.01); H02K 7/003 (2013.01); H02K 9/00 (2013.01); H02K 9/22 (2013.01); H02K 11/33 (2016.01); H05K 1/181 (2013.01); F01P 2005/046 (2013.01); H02K 7/14 (2013.01); H05K 2201/012 (2013.01); H05K 2201/066 (2013.01);
Abstract

The present invention relates to a motor, a circuit board and an engine cooling module including the motor. The motor includes a stator and a rotor. The stator includes a control module and a heat sink. The control module includes a circuit board and heat generating electronic components mounted on the circuit board. A bottom surface of the circuit board faces the heat sink. The heat generating electronic components are mounted on a top surface of the circuit board. Metal heat conducting members are embedded inside the circuit board at positions corresponding to the heat generating electronic components, and extend along a thickness direction of the circuit board. The heat generated by the heat generating electronic components is conducted from the top surface of the circuit board to the bottom surface of the circuit board. The present invention improves the heat dissipation effect of the motor.

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