The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 2021
Filed:
Oct. 08, 2020
Applicant:
Guobiao Zhang, Corvallis, OR (US);
Inventor:
Guobiao Zhang, Corvallis, OR (US);
Assignees:
HangZhou HaiCun Information Technology Co., Ltd., ZheJiang, CN;
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03K 19/173 (2006.01); H03K 19/17728 (2020.01); H03K 19/17736 (2020.01); H03K 19/1776 (2020.01); G11C 5/02 (2006.01);
U.S. Cl.
CPC ...
H03K 19/1776 (2013.01); G11C 5/02 (2013.01); H03K 19/1737 (2013.01); H03K 19/17728 (2013.01); H03K 19/17744 (2013.01); G11C 5/025 (2013.01);
Abstract
A configurable processor doublet comprises a pair of face-to-face bonded three-dimensional memory (3D-M) die and processing die. The 3D-M die comprises 3D-M arrays, whereas the processing die comprises arithmetic-logic circuits (ALC's). The preferred doublet also comprises an array of configurable computing elements (CCE's). Each CCE comprises at least a 3D-M array, an ALC, and inter-storage-processor (ISP) connections.