The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 2021
Filed:
Jan. 22, 2020
Applicant:
Sharp Kabushiki Kaisha, Sakai, JP;
Inventors:
Teruyoshi Takakura, Sakai, JP;
Yoshimi Tanimoto, Sakai, JP;
Yoshihiko Tani, Sakai, JP;
Yuhzoh Tsuda, Sakai, JP;
Assignee:
SHARP KABUSHIKI KAISHA, Sakai, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/00 (2006.01); H01S 5/22 (2006.01); H01S 5/042 (2006.01); H01S 5/10 (2021.01); H01S 5/062 (2006.01); H01S 5/343 (2006.01);
U.S. Cl.
CPC ...
H01S 5/2202 (2013.01); H01S 5/04256 (2019.08); H01S 5/0624 (2013.01); H01S 5/1003 (2013.01); H01S 5/22 (2013.01); H01S 5/2201 (2013.01); H01S 5/34333 (2013.01); H01S 2301/18 (2013.01);
Abstract
In a semiconductor laser device, a semiconductor layer includes a first groove formed on both sides of a ridge, a pair of second recesses facing each other and between which the ridge is interposed on a side of a light emitting surface, and a pair of third grooves in parallel to the first groove from the light emitting surface and interposing the ridge therebetween.