The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 21, 2021

Filed:

Oct. 29, 2019
Applicant:

Nichia Corporation, Anan, JP;

Inventor:

Toshiaki Yamashita, Komatsushima, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/60 (2010.01); F21K 9/64 (2016.01); H01L 33/64 (2010.01); H01L 33/50 (2010.01); H01S 5/02257 (2021.01); H01L 33/44 (2010.01); F21S 41/16 (2018.01); H01S 5/00 (2006.01); H01S 5/02212 (2021.01); H01S 5/024 (2006.01); H01L 33/40 (2010.01); H01L 33/54 (2010.01);
U.S. Cl.
CPC ...
H01S 5/0087 (2021.01); F21K 9/64 (2016.08); H01L 33/44 (2013.01); H01L 33/507 (2013.01); H01L 33/60 (2013.01); H01L 33/644 (2013.01); H01S 5/02257 (2021.01); F21S 41/16 (2018.01); H01L 33/405 (2013.01); H01L 33/50 (2013.01); H01L 33/54 (2013.01); H01S 5/02212 (2013.01); H01S 5/02469 (2013.01);
Abstract

A light-emitting device includes: a semiconductor laser element; a surrounding member surrounding the semiconductor laser element; a fluorescent member containing a fluorescent material that is excitable by light emitted from the semiconductor laser element so as to emit light having a wavelength different from a wavelength of the light emitted from the semiconductor laser element; a supporting member located above the surrounding member, wherein the supporting member comprises a through-hole that allows light emitted from the semiconductor laser element to pass therethrough, and wherein the fluorescent member is located in the through-hole; a light-transmissive heat dissipating member, wherein a lower surface of the heat dissipating member is bonded to the surrounding member, and an upper surface of the heat dissipating member is bonded to the supporting member; and a reflective film disposed on the heat dissipating member.


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