The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 21, 2021

Filed:

Jul. 08, 2019
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Hong In Kim, Suwon-si, KR;

Hyung Ho Seo, Suwon-si, KR;

Young Kyoon Im, Suwon-si, KR;

Kyu Bum Han, Suwon-si, KR;

Jeong Ki Ryoo, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01Q 1/38 (2006.01); H01Q 9/04 (2006.01); H01Q 21/00 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01Q 1/22 (2013.01); H01Q 1/38 (2013.01); H01Q 9/04 (2013.01); H01Q 9/0407 (2013.01); H01Q 9/0485 (2013.01); H01Q 21/00 (2013.01); H01Q 21/0006 (2013.01); H05K 1/147 (2013.01); H05K 1/181 (2013.01); H01L 2224/16245 (2013.01);
Abstract

An antenna module includes an integrated circuit (IC) package, a first antenna package, a second antenna package, and a connection member. The IC package includes an IC and mounting electrical connection structures. The first antenna package includes a first patch antenna pattern, a first feed via connected to the first patch antenna pattern, and a first antenna dielectric layer surrounding at least a portion of the first feed via. The second antenna package includes a second patch antenna pattern, a second feed via connected to the second patch antenna pattern, and a second antenna dielectric layer surrounding at least a portion of the second feed via, and disposed to be spaced apart from the first antenna package. The connection member, connecting the IC to the first feed via and the second feed via, connects to the mounting electrical connection structures, and having a stacked structure.


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