The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 21, 2021

Filed:

Jul. 09, 2018
Applicant:

Osram Oled Gmbh, Regensburg, DE;

Inventor:

Andreas Ploessl, Regensburg, DE;

Assignee:

OSRAM OLED GmbH, Regensburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/00 (2006.01); H01L 33/62 (2010.01); B23K 35/368 (2006.01); H01L 33/00 (2010.01); H01L 33/36 (2010.01); H01L 23/00 (2006.01); B23K 35/02 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); B23K 35/025 (2013.01); B23K 35/368 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/95 (2013.01); H01L 33/007 (2013.01); H01L 33/0093 (2020.05); H01L 33/36 (2013.01); B23K 2101/40 (2018.08); H01L 2224/16058 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/2901 (2013.01); H01L 2224/29005 (2013.01); H01L 2224/29026 (2013.01); H01L 2224/29105 (2013.01); H01L 2224/29109 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29113 (2013.01); H01L 2224/29116 (2013.01); H01L 2224/29118 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/81143 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83143 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83815 (2013.01); H01L 2924/014 (2013.01); H01L 2924/12041 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0066 (2013.01);
Abstract

The method for assembling a carrier comprises a step A), in which a plurality of pigments (), each with an electronic component (), is provided. Further, each pigment comprises a meltable solder material () directly adjoining a mounting side () of the component. At least 63% by volume of each pigment is formed by the solder material. The mounting side of each component has a higher wettability with the molten solder material than a top side () and a side surface () of the component. In a step B), a carrier () with pigment landing areas () is provided, the pigment landing areas having higher wettability with the molten solder material of the pigments than the regions laterally adjacent to the pigment landing areas and than the side surfaces and the top sides of the components. In a step C), the pigments are applied to the carrier. In a step D), the pigments are heated so that the solder material melts.


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