The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 21, 2021

Filed:

Dec. 27, 2019
Applicant:

Lumileds Llc, San Jose, CA (US);

Inventors:

Yue Chau Kwan, Singapore, SG;

Li Ma, Singapore, SG;

Liang Zhang, Singapore, SG;

Kenneth Morgan Davis, Raleigh, NC (US);

Bing Xuan Li, Singapore, SG;

Assignee:

Lumileds LLC, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/62 (2010.01); H01L 23/00 (2006.01); H01L 33/10 (2010.01); H01L 33/52 (2010.01); H01L 33/40 (2010.01);
U.S. Cl.
CPC ...
H01L 33/005 (2013.01); H01L 24/01 (2013.01); H01L 33/10 (2013.01); H01L 33/405 (2013.01); H01L 33/52 (2013.01); H01L 33/62 (2013.01); H01L 2933/0016 (2013.01);
Abstract

A method for allowing a reflective layer to abut against an edge of a metal contact while preventing contamination of a metal contact for an LED die is provided. The method includes encapsulating an electrical contact (i.e. metal contact) via with a barrier layer prior to deposition of a reflective film layer. The barrier layer encapsulates the metal contact by defining a mask pattern with a larger size than the metal contact via, which prevents the metal contact from becoming contaminated by the reflective film. This encapsulation reduces contamination of the metal contact and also reduces the voltage drop during operation of the LED die.


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