The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 21, 2021

Filed:

May. 17, 2018
Applicant:

Lfoundry S.r.l., Avezzano, IT;

Inventors:

Giovanni De Amicis, L'Aquila, IT;

Andrea Del Monte, Pomezia, IT;

Onorato Di Cola, Barete, IT;

Assignee:

LFOUNDRY S.R.L., Avezzano, IT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 21/18 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1469 (2013.01); H01L 21/187 (2013.01); H01L 24/08 (2013.01); H01L 24/80 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 27/14634 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/80011 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01);
Abstract

A method to perform hybrid bonding of two semiconductor wafers without using a dedicated tool for thermo-compression is disclosed. According to the herein disclosed technique, the semiconductor wafers to be bonded together may be placed in an oven simply staying one upon the other without applying any additional compression between them besides their own weight. This outstanding result has been attained using of a particular type of thermosetting materials, namely siloxane polymers of the type that shrink when cured. Among these siloxane polymers, the siloxane polymers of the type SC-480, siloxane polymers of the series SC-200, SC-300, SC-400, SC-500, SC-700, SC-800 and mixtures thereof are particularly suitable.


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