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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11127716 B1

PDFFull Text
Date of Patent:
Sep. 21, 2021

Filed:

Mar. 27, 2019

Mounting structures for integrated device packages

Applicant:

Analog Devices International Unlimited Company, Limerick, IE;

Inventors:

Rigan McGeehan, Limerick, IE;

Cillian Burke, Limerick, IE;

Alan J. O'Donnell, Castletroy, IE;

Assignee:

Analog Devices International Unlimited Company, Limerick, IE;

Attorney:

Knobbe, Martens, Olson & Bear, LLP

Primary Examiner:

Sonya McCall-Shepard

Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 21/304 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); B81B 7/00 (2006.01); H01L 23/495 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/304 (2013.01); H01L 21/78 (2013.01); H01L 24/50 (2013.01); H01L 24/73 (2013.01); H01L 25/50 (2013.01); H01L 2224/73229 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06579 (2013.01); H01L 2225/06582 (2013.01); H01L 2225/06589 (2013.01);
Abstract

An integrated device package is disclosed. The package can include a carrier and an integrated device die having a front side and a back side. A mounting structure can serve to mount the back side of the integrated device die to the carrier. The mounting structure can comprise a first layer over the carrier and a second element between the back side of the integrated device die and the first layer. The first layer can comprise a first insulating material that adheres to the carrier, and the second element can comprise a second insulating material.

Find Patent Forward Citations

McGeehan, Rigan. (2021). Mounting structures for integrated device packages (U.S. Patent No. 11127716). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11127716

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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