The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 2021
Filed:
Apr. 24, 2019
Samsung Electronics Co., Ltd., Suwon-si, KR;
Gun Lee, Suwon-si, KR;
Jun Gul Hwang, Suwon-si, KR;
Ji Eun Woo, Suwon-si, KR;
Sung Keun Park, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a semiconductor chip, and a connection structure disposed on at least one side of the semiconductor chip, and including an insulating layer and a redistribution layer electrically connected to the semiconductor chip, wherein the redistribution layer includes a plurality of conductive patterns, and at least two of the plurality of conductive patterns have different degrees of surface roughness, and a conductive pattern having a higher surface roughness has a width wider than a width of a conductive pattern having a lower surface roughness.