The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 2021
Filed:
Apr. 02, 2019
Qorvo Us, Inc., Greensboro, NC (US);
Thomas Scott Morris, Lewisville, NC (US);
Brian H. Calhoun, Oak Ridge, NC (US);
W. Kent Braxton, Greensboro, NC (US);
Domingo Farias, Methuen, MA (US);
Joseph Edward Geniac, Greensboro, NC (US);
Kyle Sullivan, Greensboro, NC (US);
Donald Joseph Leahy, Kernersville, NC (US);
Qorvo US, Inc., Greensboro, NC (US);
Abstract
The present disclosure relates to segmented shielding using wirebonds. In an exemplary aspect, a shield is formed from a series of wires (e.g., wirebonds) to create a wall and/or shielded compartment in an integrated circuit (IC) module. The wires can be located in any area within the IC module. The IC module may be overmolded with an insulating mold compound, and a top surface of the insulating mold can be ground or otherwise removed to expose ends of the wires to a shield layer which surrounds the insulating mold. Some examples may further laser ablate or otherwise form cavities around the ends of the wires to create stronger bonding between the wires of the shield and the shield layer.