The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 2021
Filed:
Mar. 27, 2020
Applicant:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Inventor:
Ken Wakaki, Kyoto, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H03F 1/56 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01L 25/065 (2006.01); H01L 25/16 (2006.01); H03F 3/213 (2006.01); H04B 1/40 (2015.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5383 (2013.01); H01L 23/3121 (2013.01); H01L 23/49811 (2013.01); H01L 23/5386 (2013.01); H01L 23/66 (2013.01); H01L 25/0655 (2013.01); H01L 25/16 (2013.01); H03F 1/56 (2013.01); H03F 3/213 (2013.01); H04B 1/40 (2013.01); H01L 24/16 (2013.01); H01L 2223/6655 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/30111 (2013.01); H03F 2200/294 (2013.01); H03F 2200/387 (2013.01); H03F 2200/451 (2013.01);
Abstract
A radio-frequency module () includes an IC chip () and a mounted component () mounted on the IC chip (). The IC chip () includes a core substrate () composed of a semiconductor having a first main surface () and a second main surface () opposed to each other, and a metal wiring layer () formed on the first main surface () of the core substrate () and having a contact surface in contact with the first main surface () and a third main surface () opposed to the contact surface. The mounted component () is mounted at the third main surface () side.