The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 21, 2021

Filed:

Aug. 24, 2018
Applicant:

Suncall Corporation, Kyoto, JP;

Inventor:

Masaya Nakagawa, Kyoto, JP;

Assignee:

Suncall Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/50 (2006.01); H01L 21/48 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 23/50 (2013.01); H01L 21/4839 (2013.01); H01L 33/62 (2013.01);
Abstract

A busbar assembly according to the present invention includes a first busbar formed by a conductive metal flat plate; a second busbar formed by a conductive metal flat plate, the second busbar disposed in the same plane as the first busbar with a gap being provided between opposing side surfaces of the first and second busbars; and an insulating resin layer filled in the gap so as to mechanically connect the opposing side surfaces of the first and second busbars. Preferably, the opposing side surface of at least one of the first and second busbars is an inclined surface that is closer to the opposing side surface of the other of the first and second busbars from one side toward the other side in the thickness direction.


Find Patent Forward Citations

Nakagawa, Masaya. (2021). Busbar assembly (U.S. Patent No. 11127672). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11127672

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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