The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 21, 2021

Filed:

Jul. 19, 2019
Applicant:

Qorvo Us, Inc., Greensboro, NC (US);

Inventor:

Deep C. Dumka, Richardson, TX (US);

Assignee:

Qorvo US, Inc., Greensboro, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/538 (2006.01); H05K 3/34 (2006.01); H05K 3/40 (2006.01); H01L 23/00 (2006.01); H01L 21/52 (2006.01); H01L 21/56 (2006.01); H01L 25/18 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 21/486 (2013.01); H01L 21/52 (2013.01); H01L 21/561 (2013.01); H01L 23/49811 (2013.01); H01L 23/5384 (2013.01); H01L 23/5389 (2013.01); H01L 24/24 (2013.01); H01L 24/47 (2013.01); H01L 24/82 (2013.01); H01L 25/18 (2013.01); H05K 3/3436 (2013.01); H05K 3/4007 (2013.01); H01L 23/5386 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/24227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92244 (2013.01); H01L 2224/92247 (2013.01); H01L 2224/94 (2013.01); H01L 2224/97 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10271 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01);
Abstract

A module assembly includes an adapter substrate with at least one cavity and a surface mounted die mounted on a top surface of the adapter substrate. The first cavity extends through the adapter substrate and has at least one first side wall. A first metallization layer is provided within the cavity. A first recessed die is attached to the first metallization layer and mounted within the cavity such that the first recessed die is at least partially recessed into the first cavity and surrounded by a gap filler that resides between side portions of the first recessed die and the at least one first side wall. The top surface of the gap filler is flush with the top surface of the adapter substrate and a top surface of the first recessed die.


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