Semiconductor device

Abstract

The disclosure provides a semiconductor device. The device includes first and second substrates, first mounting layers, second mounting layers, power supply terminals, an output terminal, electroconductive coupling members and switching elements. The first substrate has first obverse and reverse surfaces facing in a thickness direction. The second substrate has a second obverse surface facing as the first obverse surface faces in the thickness direction and a second reverse surface facing away from the second obverse surface. The second substrate is spaced from the first substrate in a first direction crossing the thickness direction. The first mounting layers are electrically conductive and disposed on the first obverse surface. The second mounting layers are electrically conductive and disposed on the second obverse surface. The power supply terminals are electrically connected to the first mounting layers. The output terminal is connected to one of the second mounting layers. The electroconductive coupling members are connected to the first and second mounting layers. The switching elements are mounted on the first and second mounting layers. Each of the electroconductive coupling members has strip sections and a connecting section. The strip sections extend in the first direction and are spaced in a second direction crossing the thickness direction and the first direction. The connecting section extends in the second direction to interconnect the strip sections. The strip sections are connected at one end to the first mounting layer and connected at another end to the second mounting layer.