The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 2021
Filed:
Sep. 04, 2017
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Osamu Usui, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/52 (2006.01); H01L 23/48 (2006.01); H01L 21/18 (2006.01); H01L 23/02 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/52 (2013.01); H01L 21/185 (2013.01); H01L 23/02 (2013.01); H01L 23/48 (2013.01); H01L 24/32 (2013.01);
Abstract
A semiconductor chip () includes a surface electrode (). A conductive bonding member () includes first and second bonding members () provided on the surface electrode (). A lead electrode () is bonded to a part of the surface electrode () via the first bonding member () and has no contact with the second bonding member (). A signal wire () is bonded to the surface electrode (). The second bonding member () is arranged between the first bonding member () and the signal wire (). A thickness of the first bonding member () is larger than a thickness of the second bonding member ().