The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 2021
Filed:
Nov. 22, 2017
Applicant:
King Abdullah University of Science and Technology, Thuwal, SA;
Inventors:
Adrián César Cavazos Sepulveda, Nuevo Leon, MX;
Muhammad Mustafa Hussain, Austin, TX (US);
Assignee:
KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY, Thuwal, SA;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 23/00 (2006.01); H01L 29/06 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02035 (2013.01); H01L 21/30604 (2013.01); H01L 23/564 (2013.01); H01L 29/0657 (2013.01);
Abstract
An out-of-plane deformable semiconductor substrate includes a plurality of rigid portions having a first thickness and an out-of-plane deformable portion having a second thickness and connecting the plurality of rigid portions to each other. The second thickness is smaller than the first thickness. The out-of-plane deformable semiconductor substrate is monolithic.