The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 21, 2021

Filed:

Aug. 03, 2018
Applicant:

Hamamatsu Photonics K.k., Hamamatsu, JP;

Inventors:

Yasuhide Naito, Hamamatsu, JP;

Takayuki Ohmura, Hamamatsu, JP;

Masahiro Kotani, Hamamatsu, JP;

Assignee:

HAMAMATSU PHOTONICS K.K., Hamamatsu, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 49/04 (2006.01); H01J 49/02 (2006.01); H01J 49/16 (2006.01);
U.S. Cl.
CPC ...
H01J 49/0418 (2013.01); H01J 49/022 (2013.01); H01J 49/025 (2013.01); H01J 49/164 (2013.01);
Abstract

A laser desorption/ionization method includes a first process of preparing a sample support body. The sample support body includes a substrate, an ionization substrate, and a support that supports the ionization substrate with respect to the substrate such that a first surface of the ionization substrate is separated from the substrate. A plurality of through-holes are formed at least in measurement regions of the ionization substrate. A conductive layer is provided on peripheral edges of the through-holes at least on the second surface. Further, the laser desorption/ionization method includes a second process of dropping the sample on the measurement regions of the ionization substrate, and a third process of, after the sample has infiltrated into the ionization substrate, ionizing components of the sample by applying a laser beam to the second surface while applying a voltage to the conductive layer.


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