The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 21, 2021

Filed:

Aug. 09, 2018
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Soon Kwang Kwon, Suwon-si, KR;

Joong Won Park, Suwon-si, KR;

Young Seuck Yoo, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 3/14 (2006.01); H01F 27/30 (2006.01); H01B 3/40 (2006.01); H01F 27/26 (2006.01); H01F 27/255 (2006.01); H01F 1/153 (2006.01); H01F 1/147 (2006.01);
U.S. Cl.
CPC ...
H01F 3/14 (2013.01); H01B 3/40 (2013.01); H01F 27/263 (2013.01); H01F 27/306 (2013.01); H01F 1/14708 (2013.01); H01F 1/14791 (2013.01); H01F 1/15325 (2013.01); H01F 27/255 (2013.01);
Abstract

A coil component includes a body having a winding type coil and a core in which the winding type coil is embedded, and external electrodes disposed on external surfaces of the body. The core includes first and second cores, and the first and second cores are coupled to each other with a bonding surface interposed therebetween. The bonding surface is formed of a same type of resin as the first and second cores. The first and second cores each include a resin directly covering surfaces of magnetic powder particles, such that adjacent particles are separated only by the resin. A method of manufacturing the coil component includes applying a solvent to dissolve a resin on a bonding surface of the first core, and mounting the second core to the bonding surface having the solvent applied thereto.


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