The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 21, 2021

Filed:

Dec. 06, 2019
Applicant:

Xilinx, Inc., San Jose, CA (US);

Inventors:

Xiaoqian Zhang, San Jose, CA (US);

Ephrem C. Wu, San Mateo, CA (US);

David Berman, San Jose, CA (US);

Assignee:

Xilinx, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 7/10 (2006.01); G06N 3/06 (2006.01); G11C 7/22 (2006.01);
U.S. Cl.
CPC ...
G11C 7/1084 (2013.01); G06N 3/06 (2013.01); G11C 7/1048 (2013.01); G11C 7/1057 (2013.01); G11C 7/222 (2013.01);
Abstract

An integrated circuit (IC) includes a plurality of dies. The IC includes a plurality of memory channel interfaces configured to communicate with a memory, wherein the plurality of memory channel interfaces are disposed within a first die of the plurality of dies. The IC may include a compute array distributed across the plurality of dies and a plurality of remote buffers distributed across the plurality of dies. The plurality of remote buffers are coupled to the plurality of memory channels and to the compute array. The IC further includes a controller configured to determine that each of the plurality of remote buffers has data stored therein and, in response, broadcast a read enable signal to each of the plurality of remote buffers initiating data transfers from the plurality of remote buffers to the compute array across the plurality of dies.


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