The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 21, 2021

Filed:

Jul. 03, 2018
Applicant:

Playnitride Inc., Tainan, TW;

Inventors:

Yun-Li Li, Tainan, TW;

Tzu-Yang Lin, Tainan, TW;

Yu-Hung Lai, Tainan, TW;

Po-Jen Su, Tainan, TW;

Hsuan-Wei Mai, Tainan, TW;

Assignee:

PlayNitride Inc., Hsinchu County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G09G 3/32 (2016.01); H01L 23/48 (2006.01); H01L 25/075 (2006.01); F21Y 115/10 (2016.01); H01L 33/62 (2010.01); H01L 33/52 (2010.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G09G 3/32 (2013.01); H01L 23/481 (2013.01); H01L 25/0753 (2013.01); F21Y 2115/10 (2016.08); H01L 24/16 (2013.01); H01L 33/52 (2013.01); H01L 33/62 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01);
Abstract

A light emitting module including a circuit carrier and a plurality of light emitting devices is provided. The circuit carrier includes a first circuit layer, a second circuit layer, a dielectric layer and a plurality of conductive vias. The first circuit layer and the second circuit layer are located at two opposite sides of the dielectric layer. The conductive vias pass through the dielectric layer and two opposite end portions of each of the conductive vias are respectively connected to the first circuit layer and the second circuit layer. The light emitting devices are electrically bonded to the first circuit layer. Moreover, the light emitting devices are disposed in a device disposing area of the circuit carrier and the conductive vias are arranged outside the device disposing area. A display device is also provided.


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