Identifying critical thermal conditions in multiple system-on-a-chip (soc) systems

Abstract

Techniques for identifying thermal critical conditions in devices with multiple SoCs, and coordinating the resetting and rebooting of the SoCs to recover from the thermal critical conditions are described herein. A device may include a first SoC that monitors a first temperature sensor, and a second SoC that monitors a second temperature sensor, to determine whether temperatures in the device indicate thermal critical conditions. The second SoC may determine that a temperature determined using the second temperature sensor is above a threshold indicating a thermal critical condition, and may provide an indication to the first SoC that the temperature is above the threshold. The first SoC may detect the indication, and the first SoC and second SoC may each reset to allow the device to cool down. The first SoC and second SoC may then coordinate rebooting once the thermal critical condition is no longer detected in the device.