The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 21, 2021

Filed:

Jun. 08, 2020
Applicant:

Te Connectivity Corporation, Berwyn, PA (US);

Inventors:

Bruce Allen Champion, Camp Hill, PA (US);

Christopher William Blackburn, Bothell, WA (US);

Michael David Herring, Apex, NC (US);

Eric David Briant, Dillsburg, PA (US);

Assignee:

TE CONNECTIVITY SERVICES GmbH, Schaffhausen, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); H01R 12/71 (2011.01); H01R 12/79 (2011.01); H01R 12/70 (2011.01); H01R 13/6582 (2011.01); H01R 13/66 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4284 (2013.01); G02B 6/428 (2013.01); G02B 6/4249 (2013.01); G02B 6/4278 (2013.01); H01R 12/7005 (2013.01); H01R 12/714 (2013.01); H01R 12/79 (2013.01); H01R 13/6582 (2013.01); H01R 13/6658 (2013.01);
Abstract

A communication system includes a host circuit board and an interposer assembly coupled to the host circuit board having an interposer substrate including an host circuit board contacts at a lower surface and module contacts at an upper surface. The communication system includes an optical pluggable module having a mating interface along a bottom of the optical pluggable module facing the interposer assembly. The optical pluggable module includes a module substrate and optical engines coupled to the module substrate with optical fiber cables extending from the optical engines to the cable end. The module substrate has module substrate contacts at a lower surface of the module substrate being electrically connected to corresponding module contacts of the interposer assembly at the upper surface of the interposer substrate.


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