The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 21, 2021

Filed:

Oct. 21, 2019
Applicant:

Aeponyx Inc., Montreal, CA;

Inventors:

Francois Menard, Trois-Rivieres, CA;

Frederic Nabki, Montreal, CA;

Michael Menard, Verdun, CA;

Martin Berard, Repentigny, CA;

Assignee:

Aeponyx Inc., Repentigny, CA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/35 (2006.01); G02B 6/124 (2006.01); B81B 5/00 (2006.01); G02B 6/122 (2006.01); G02B 6/42 (2006.01); G02B 6/00 (2006.01); G02B 6/12 (2006.01);
U.S. Cl.
CPC ...
G02B 6/3518 (2013.01); B81B 5/00 (2013.01); G02B 6/00 (2013.01); G02B 6/12004 (2013.01); G02B 6/124 (2013.01); G02B 6/1228 (2013.01); G02B 6/357 (2013.01); G02B 6/3596 (2013.01); G02B 6/4214 (2013.01); B81B 2201/033 (2013.01); B81B 2201/042 (2013.01); G02B 2006/12061 (2013.01); G02B 2006/12078 (2013.01); G02B 2006/12085 (2013.01); G02B 2006/12104 (2013.01); G02B 2006/12107 (2013.01); G02B 2006/12121 (2013.01); G02B 2006/12145 (2013.01);
Abstract

Hybrid optical integration places very strict manufacturing tolerances and performance requirements upon the multiple elements to exploit passive alignment techniques as well as having additional processing requirements. Alternatively, active alignment and soldering/fixing where feasible is also complex and time consuming with 3, 4, or 6-axis control of each element. However, microelectromechanical (MEMS) systems can sense, control, and activate mechanical processes on the micro scale. Beneficially, therefore the inventors combine silicon MEMS based micro-actuators with silicon CMOS control and drive circuits in order to provide alignment of elements within a silicon optical circuit either with respect to each other or with other optical elements hybridly integrated such as compound semiconductor elements. Such inventive MEMS based circuits may be either maintained as active during deployment or powered off once the alignment has been 'locked' through an attachment/retention/latching process.


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