The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 2021
Filed:
Oct. 18, 2018
International Business Machines Corporation, Armonk, NY (US);
Kushagra Sinha, Wappingers Falls, NY (US);
Pablo Nieves, Schenectady, NY (US);
Reinaldo Vega, Mahopac, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A test probe assembly for determining the integrity of a test pad of a semiconductor wafer. The test probe assembly includes a probe card, a plurality of test probes mounted to the probe card, a fiber optic lead mounted to each test probe and arranged to direct incident light toward individual test pads of the semiconductor wafer and a plurality of photodetectors arranged about the probe card. Individual photodetectors are configured to receive light reflected off a dielectric coating of the test pad corresponding to a first set of light rays emitted by the test pad and configured to receive light reflected off a metallic base of the test pad corresponding to a second set of light rays emitted by the test pad, and to generate first and second output signals associated with the first and second sets of light rays to create image data of the individual test pads.