The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 21, 2021

Filed:

Oct. 15, 2018
Applicant:

Microsoft Technology Licensing, Llc, Redmond, WA (US);

Inventors:

Renee Wu, Los Altos, CA (US);

Michael Nikkhoo, Saratoga, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28F 21/02 (2006.01); F28F 21/06 (2006.01); B23P 15/26 (2006.01); H01L 23/373 (2006.01); H01L 23/42 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
F28F 21/02 (2013.01); B23P 15/26 (2013.01); F28F 21/065 (2013.01); H01L 23/3737 (2013.01); H01L 23/42 (2013.01); H01L 23/552 (2013.01); Y10T 29/4935 (2015.01); Y10T 29/4998 (2015.01); Y10T 29/49826 (2015.01); Y10T 29/49885 (2015.01); Y10T 29/49904 (2015.01); Y10T 29/49982 (2015.01);
Abstract

A formable structure comprises a first material having a first level of viscosity and a second material having a second level of viscosity, wherein the second material is formed to hold at least a portion of the first material in a particular position or a particular shape. The first material can be configured to function as a thermal interface between two or more hardware components. The second material can be configured to have a higher viscosity than the first material. In one illustrative example, the second material can include a light-activated resin that is configured to harden when exposed to one or more treatments. By the use of the first material and second material, the techniques disclosed herein are adaptable to gaps having a wide range of sizes, which is difficult to do with traditional thermal interface materials. The second material can also function as an EMI shield.


Find Patent Forward Citations

Loading…