The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 21, 2021

Filed:

Feb. 22, 2018
Applicant:

Uacj Corporation, Tokyo, JP;

Inventors:

Takashi Kubo, Tokyo, JP;

Tatsuya Yamada, Tokyo, JP;

Assignee:

UACJ CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C 21/06 (2006.01); B22D 11/049 (2006.01); C22F 1/047 (2006.01); B22D 11/00 (2006.01);
U.S. Cl.
CPC ...
C22C 21/06 (2013.01); B22D 11/049 (2013.01); C22F 1/047 (2013.01);
Abstract

An aluminum alloy thick plate is formed of an aluminum alloy including Mg of 2.0 to 5.0 mass %. The aluminum alloy thick plate has a plate thickness of 300 to 400 mm. A is 160 pieces/cmor less and B is 1.15 times or more as large as A, where (i) A (pieces/cm) is a maximum value in numbers of porosities with an equivalent circle diameter of 50 μm or more in each of positions located at a center portion in a plate thickness direction and at positions of 0.39 Wa to 0.48 Wa in a plate width direction; and (ii) B (pieces/cm) is a maximum value in numbers of porosities with an equivalent circle diameter of 50 μm or more in each of positions located at the center portion in the plate thickness direction and at positions of 0.12 Wa to 0.30 Wa in the plate width direction.


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